OPTIMAL CONCENTRATION OF PLATINUM IN A NICKEL FILM TO FORM AND STABILIZE NICKEL MONOSILICIDE IN A MICROELECTRONIC DEVICE . United States Patent Application 20080280439 . Kind Code: A1 . Abstract: A method of forming a nickel monosilicide layer on silicon-containing features of an electronic device that includes depositing a nickel film over the ...
Read more...These vacancies move toward the nickel/film interface more rapidly and the cation vacancy concentration remains higher at the metal/film interface, as displayed in Fig. 9(b). These factors increase the flux of the cation vacancies in the film, and the steady-state current density of the passive film, leading to a higher corrosion rate.
Read more...Journal of Electroanalytical Chemistry 457 (1998) 13 – 21 Passivating films on nickel in alkaline solutions II. Ni(II) anodic film growth: quantitative treatment and the influence of the OH − concentration C.V. D'Alkaine *, M.A. Santanna Group of Electrochemistry and Polymers-DQ-UFSCar, Depto.
Read more...91 Baba et al.: Direct Formation of Patterned Nickel Film (5/8) deposition under these conditions and considering the minute and significantly lower concentration compared to that of the Bi, detection by EPMA was not expected.
Read more...Root mean square (RMS) roughness values of the films from 21 M to M/5 over an area of 3 µm × 3 µm decrease from 5.1 nm to 3.5 nm with decreasing nickel concentration in electrolyte. Higher content of nickel in the films leads towards aggregation of nickel on surface of the film …
Read more...Nickel. Nickel sulfamate is the source of the nickel metal. Concentrations of 90 to 135 g/L (12 to 18 oz/gal) of nickel metal are used in most cases for high-speed plating, when coupled with very high solution agitation. Current densi-ties of 43 to 430 A/dm 2 (400 to 4000 A/ft ) have been used. High metal content is also used to improve ...
Read more...The total nickel ion concentration is a significant factor in the limiting current density, or the point at which nodular or burned deposits become evident. Boric acid. Boric acid buffers the hydrogen ion concentration (pH) in the cathode film. If it were not for this buffering action, the cathode film pH in the higher-current-density regions ...
Read more...A 70 kg reference man contains 10 mg of nickel, giving an average body concentration of 0.1 ppm. Reference values for nickel in healthy adults is 0.2 µg/L in serum and 1–3 µg/L in urine. A National Health and Nutritional Examination Survey II of hair found mean nickel levels of 0.39 ppm, with 10% of
Read more...The Effect of Current and Nickel Nitrate Concentration on the Deposition of Nickel Hydroxide Films Christopher C. Streinz, Andrew P. Hartman, Sathya Motupally,* and John W. Weidner** Department of Chemical Engineering, University of South Carolina, Columbia, South Carolina 29208 ABSTRACT
Read more...Nickel oxide thin films were prepared by spraying a 0.1 M solution of nickel nitrate of doubly distilled water onto the pre-heated amorphous glass substrates kept at 390˚C ± 10˚C. Film thickness was measured by using the weight difference method considering the density of the bulk nickel oxide. As the density of thin films was cer-
Read more...For example, the annealing of 7.5 nm ALD NiO x at 300°C in ambient conditions increased the work function of the film from 5.0 to 5.2 eV and the hole concentration from 4.9 × 10 19 to 1.4 × 10 20 cm −3, which was associated with the decrease in hydroxide species on the film surface. 82 However, annealing has also been reported to lead to a ...
Read more...Hydrogen (H 2) gas sensing properties of platinum (Pt) - nickel (Ni) alloy thin films deposited on a glass substrate by sputter technique are investigated depending on alloy composition, temperature and H 2 concentration. The structural properties of Pt-Ni alloy thin films are characterized by XRD, SEM and EDS techniques. The amount of Ni atom in the alloy thin films is increased from 0% …
Read more...The increase in Co concentration from 0.05 to 0.1 M helps to improve the crystallinity and increases the carrier concentration of NiO film, resulting in a decrease of resistivity.
Read more...Nickel as nickel sulphate salt is widely used in the metal plating industry. For electrochemical and chemical nickel deposition processes the nickel concentration must be kept in a certain range (e.g. 5 g/L ±0.25 g/L) to ensure high quality of the deposited nickel film. The nickel ion has an absorbance maxima at 393 nm and no absorbance at 515 nm.
Read more...hydrogen concentration, the nickel film thickness and the cooling rate on the properties of graphene. The number of layers of the graphene and its domain size were evaluated by Raman spectroscopic analysis and the surface of the graphene was observed using an optical microscope. 2. …
Read more...12%These vacancies move toward the nickel/film interface more rapidly and the cation vacancy concentration remains higher at the metal/film interface, as displayed in Fig. 9(b). These factors increase the flux of the cation vacancies in the film, and the steady-state current density of the passive film, leading to a higher corrosion rate.
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